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1

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Darveaux, Robert

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 173 KB

english, 2002

2

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Robert Darveaux, Jim Heckman, Ahmer Syed, Andrew Mawer

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 828 KB

english, 2000

3

Thermal analysis of a multi-chip package design

Robert Darveaux, Lih-Tyng Hwang, Arnold Reisman, Iwona Turlik

Journal:

Journal of Electronic Materials

Year:

1989

Language:

english

File:

PDF, 809 KB

english, 1989

4

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of joint size and pad metallization on solder mechanical properties

Darveaux, Robert, Reichman, Corey, Berry, C.J., Wen-Sung Hsu,, Syed, Ahmer, Chang Woo Kim,, Jung Hun Ri,, Tae Seong Kim,

Year:

2008

Language:

english

File:

PDF, 670 KB

english, 2008

5

Predictive thermal and mechanical modeling of a developmental MCM

Robert Darveaux, K. Linga Murty, Iwona Turlik

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1992

Language:

english

File:

PDF, 966 KB

english, 1992

6

[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Temperature dependent mechanical behavior of plastic packaging materials

Darveaux, R., Norton, L., Carney, F.

Year:

1995

Language:

english

File:

PDF, 449 KB

english, 1995

7

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Effect of simulation methodology on solder joint crack growth correlation

Year:

2000

Language:

english

File:

PDF, 952 KB

english, 2000

8

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Ductile-to-brittle transition strain rate

Darveaux, Robert, Reichman, Corey

Year:

2006

Language:

english

File:

PDF, 231 KB

english, 2006

9

Model for BGA and CSP Reliability in Automotive Underhood Applications

Lall, P., Islam, M.N., Singh, N., Suhling, J.C., Darveaux, R.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2004

Language:

english

File:

PDF, 1.64 MB

english, 2004

10

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes

Gerber, Mark, Beddingfield, Craig, O'Connor, Shawn, Yoo, Min, Lee, MinJae, Kang, DaeByoung, Park, SungSu, Zwenger, Curtis, Darveaux, Robert, Lanzone, Robert, Park, KyungRok

Year:

2011

Language:

english

File:

PDF, 1.57 MB

english, 2011

11

[IEEE IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. - Munich, Germany (11-12 April 2005)] IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. - Critical challenges in packaging MEMS devices

Robert Darveaux,, Lakshmi Munukutla,

Year:

2005

Language:

english

File:

PDF, 1.42 MB

english, 2005

12

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Solidification behavior of lead free and tin lead solder bumps

Darveaux, Robert, Reichman, Corey, Agrawal, Parul

Year:

2010

Language:

english

File:

PDF, 744 KB

english, 2010

13

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Study of FCMBGA with low CTE core substrate

Boo Yang Jung,, Jae Yun Gim,, Min Yoo,, Jae Dong Kim,, Choon Heung Lee,, Jimarez, Miguel, Islam, Nokibul, Darveaux, Robert

Year:

2009

Language:

english

File:

PDF, 1.27 MB

english, 2009

14

Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics

Lall, P., Gupte, S., Choudhary, P., Darveaux, R.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 2.56 MB

english, 2009

15

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition

Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., Batchelor, Bill

Year:

2009

Language:

english

File:

PDF, 927 KB

english, 2009

16

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Mechanical Properties of Lead-Free Solders

Darveaux, Robert, Reichman, Corey

Year:

2007

Language:

english

File:

PDF, 3.30 MB

english, 2007

17

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Interface Failure in Lead Free Solder Joints

Darveaux, R., Reichman, C., Islam, N.

Year:

2006

Language:

english

File:

PDF, 1.23 MB

english, 2006

18

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Field use environment for a FCBGA in a laptop computer application

Darveaux, Robert, Reichman, Corey, Berry, Christopher J.

Year:

2009

Language:

english

File:

PDF, 1.83 MB

english, 2009

19

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Factors affecting Pb-free flip chip bump reliability modeling for life prediction

Syed, Ahmer, Sharon, Gil, Darveaux, Robert

Year:

2012

Language:

english

File:

PDF, 1.56 MB

english, 2012

20

Biologics in Asthma—The Next Step Toward Personalized Treatment

Darveaux, Jared, Busse, William W.

Journal:

The Journal of Allergy and Clinical Immunology: In Practice

Year:

2015

Language:

english

File:

PDF, 1.38 MB

english, 2015

21

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Crack initiation and growth in WLCSP solder joints

Darveaux, Robert, Enayet, Sabira, Reichman, Corey, Berry, Christopher J., Zafar, Nabeel

Year:

2011

Language:

english

File:

PDF, 3.35 MB

english, 2011

22

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics

Lall, Pradeep, Gupte, Sameep, Choudhary, Prakriti, Suhling, Jeff, Darveaux, Robert

Year:

2007

Language:

english

File:

PDF, 7.24 MB

english, 2007

23

Mechanical Characteristics of In and Pb5Sn Solders in a Thinfilm Multichip Package

Darveaux, Robert, Yung, Edward, Turlik, Iwona, Murty, K.L.

Journal:

MRS Proceedings

Year:

1990

Language:

english

File:

PDF, 324 KB

english, 1990

24

Optimizing production and evaluating biosynthesis in situ of a herbicidal compound, mevalocidin, fromConiolariellasp.

Sica, Vincent P., Figueroa, Mario, Raja, Huzefa A., El-Elimat, Tamam, Darveaux, Blaise A., Pearce, Cedric J., Oberlies, Nicholas H.

Journal:

Journal of Industrial Microbiology & Biotechnology

Year:

2016

Language:

english

File:

PDF, 893 KB

english, 2016

25

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization

Hoang, Jimmy-Dinh V., Darveaux, Robert, Lobianco, Tony, Liu, Yi, Nguyen, Wayne

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

26

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - BGA Reliability in Automotive Underhood Applications

Lall, Pradeep, Islam, Nokibul, Suhling, Jeffrey, Darveaux, Robert

Year:

2003

Language:

english

File:

PDF, 1.07 MB

english, 2003

27

Global nutritional profiling for mutant and chemical mode-of-action analysis in filamentous fungi

MatthewM. Tanzer, HerbertN. Arst, AmyR. Skalchunes, Marie Coffin, BlaiseA. Darveaux, RyanW. Heiniger, JeffreyR. Shuster

Journal:

Functional & Integrative Genomics

Year:

2004

Language:

english

File:

PDF, 367 KB

english, 2004

28

Global nutritional profiling for mutant and chemical mode-of-action analysis in filamentous fungi

MatthewM. Tanzer, HerbertN. Arst, AmyR. Skalchunes, Marie Coffin, BlaiseA. Darveaux, RyanW. Heiniger, JeffreyR. Shuster

Journal:

Functional & Integrative Genomics

Year:

2003

Language:

english

File:

PDF, 681 KB

english, 2003

29

Isolation and Identification of the Icosalides—Cyclic Peptolides with Selective Antibiotic and Cytotoxic Activities

Boros, Christie, Smith, Cameron J, Vasina, Yelena, Che, Yongsheng, Dix, Alissa B, Darveaux, Blaise, Pearce, Cedric

Journal:

The Journal of Antibiotics

Year:

2006

File:

PDF, 151 KB

2006

30

Obionin B: an o-pyranonaphthoquinone decaketide from an unidentified fungus (MSX 63619) from the order Pleosporales

Sloan Ayers, Tyler N. Graf, Audrey F. Adcock, David J. Kroll, Qi Shen, Steven M. Swanson, Mansukh C. Wani, Blaise A. Darveaux, Cedric J. Pearce, Nicholas H. Oberlies

Journal:

Tetrahedron Letters

Year:

2011

Language:

english

File:

PDF, 264 KB

english, 2011

31

Constitutive relations for tin-based solder joints

Darveaux, R., Banerji, K.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1992

Language:

english

File:

PDF, 1.10 MB

english, 1992

32

A new character for identifying larval instars of Prostephanus truncatus (Horn) (Coleoptera: Bostrichidae)

Bh. Subramanyam, L.K. Cutkomp, B.A. Darveaux

Journal:

Journal of Stored Products Research

Year:

1985

Language:

english

File:

PDF, 343 KB

english, 1985

33

Thermal stress analysis of a multichip package design

Darveaux, R., Turlik, I., Hwang, L.-T., Reisman, A.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1989

Language:

english

File:

PDF, 804 KB

english, 1989

34

Shear deformation of indium solder joints

Darveaux, R., Turlik, I.

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1990

Language:

english

File:

PDF, 996 KB

english, 1990

35

Cytotoxic xanthone–anthraquinone heterodimers from an unidentified fungus of the order Hypocreales (MSX 17022)

Ayers, Sloan, Graf, Tyler N, Adcock, Audrey F, Kroll, David J, Shen, Qi, Swanson, Steven M, Matthew, Susan, Carcache de Blanco, Esperanza J, Wani, Mansukh C, Darveaux, Blaise A, Pearce, Cedric J, Ober

Journal:

The Journal of Antibiotics

Year:

2012

Language:

english

File:

PDF, 374 KB

english, 2012

36

[IEEE 1991 41st Electronic Components & Technology Conference - Atlanta, GA, USA (11-16 May 1991)] 1991 Proceedings 41st Electronic Components & Technology Conference - Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relation

Darveaux, R., Banerji, K.

Year:

1991

Language:

english

File:

PDF, 707 KB

english, 1991

37

Erratum

Darveaux, Jared I., Huttenlocher, Anna, Bennett, Daniel, Smith, Judith, Seroogy, Christine M., Gern, James E.

Journal:

Annals of Vascular Surgery

Year:

2012

Language:

english

File:

PDF, 154 KB

english, 2012

38

A Patient With a Novel Leukocyte Adhesion Deficiency and Pyoderma Gangrenosum-Like Disease

Darveaux, Jared I., Huttenlocher, Anna, Bennett, Daniel, Smith, Judith, Seroogy, Christine M., Gern, James E.

Journal:

Journal of Allergy and Clinical Immunology

Year:

2014

Language:

english

File:

PDF, 39 KB

english, 2014

39

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Challenges of megapixel camera module assembly and test

Chowdhury, A., Darveaux, R., Tome, J., Schoonejongen, R., Reifel, M., De Guzman, A., Sung Soon Park,, Yong Woo Kim,, Hyung Wook Kim,

Year:

2005

Language:

english

File:

PDF, 1.23 MB

english, 2005

40

[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems - Las Vegas, NV, USA (23-25 May 1990)] InterSociety Conference on Thermal Phenomena in Electronic Systems - Shear deformation of indium solder joints

Darveaux, R., Turlik, I.

Year:

1990

Language:

english

File:

PDF, 1.11 MB

english, 1990

41

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

Limaye, P., Vandevelde, B., Van de Peer, J., Doaders, S., Darveaux, R.

Year:

2005

Language:

english

File:

PDF, 1.20 MB

english, 2005

42

[IEEE 28th International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (16-18 July 2003)] IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. - Board level reliability evaluation of RF PA module vias

Darveaux, R., Jicheng Yang,, Syed, A., Buella, B., Villareal, P., Kang, W.J.

Year:

2003

Language:

english

File:

PDF, 554 KB

english, 2003

43

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Low cost uncooled mini-DIL module for pump laser

Jicheng Yang,, Darveaux, R., Greenwood, J.

Year:

2002

Language:

english

File:

PDF, 554 KB

english, 2002

44

[IEEE Proceedings., 39th Electronic Components Conference - Houston, TX, USA (22-24 May 1989)] Proceedings., 39th Electronic Components Conference - Thermal stress analysis of a multichip package design

Darveaux, R., Hwang, L.-T., Reisman, A., Turlik, I.

Year:

1989

Language:

english

File:

PDF, 432 KB

english, 1989

45

[IEEE 1992 42nd Electronic Components & Technology Conference - San Diego, CA, USA (18-20 May 1992)] 1992 Proceedings 42nd Electronic Components & Technology Conference - Constitutive relations for tin-based-solder joints

Darveaux, R., Banerji, K.

Year:

1992

Language:

english

File:

PDF, 1.05 MB

english, 1992

46

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Fine Pitch (150/spl mu/m) Pb-Free Flip-Chip Bumping and Packaging

Nicholls, L., Darveaux, R., Hansen, B., Carey, C., Aoki, T., Akimoto, T., Chang, J.

Year:

2006

Language:

english

File:

PDF, 1.83 MB

english, 2006

47

Infection-Related Asthma

Darveaux, Jared I., Lemanske, Robert F.

Journal:

The Journal of Allergy and Clinical Immunology: In Practice

Year:

2014

Language:

english

File:

PDF, 406 KB

english, 2014

48

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - RF PA module substrate via reliability

Darveaux, R., Jicheng Yang,, Sheridan, R., Buella, B., Villareal, P.

Year:

2003

Language:

english

File:

PDF, 734 KB

english, 2003

49

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Model for BGA and CSP reliability in automotive underhood applications

Lail, P., Islam, N., Suhling, J., Darveaux, R.

Year:

2003

Language:

english

File:

PDF, 653 KB

english, 2003

50

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Shear deformation of lead free solder joints

Year:

2005

Language:

english

File:

PDF, 684 KB

english, 2005